Must not exceed maximum thresholds to prevent PCB warping or pin buckling.
The standard establishes strict criteria for the physical and electrical integrity of the connection:
Minimum and maximum board thickness requirements for consistent insertion results. 3. Test Methods
IEC 60352‑5 is part of the IEC 60352 series of standards, all of which deal with solderless connections — electrical connections that are made without the use of heat or solder. Instead, they rely on mechanical deformation, pressure or other physical means to create a reliable, gas‑tight metallic contact. The fifth part of the series is dedicated to , also known as press‑fit connections, which are widely used in modern electronic assemblies. iec 603525 pdf
Whether you are a design engineer, a test technician or a compliance manager, having the correct, up‑to‑date version of IEC 60352‑5 is essential for ensuring that your press‑in connections are reliable, durable and compliant with international expectations.
Since the correct standard is likely , here are the only legitimate channels to obtain a genuine, up-to-date PDF.
To determine the suitability and electrical stability of these connections under specified mechanical, electrical, and atmospheric/environmental conditions. iTeh Standards 🔍 Key Areas Covered General Requirements: Must not exceed maximum thresholds to prevent PCB
The IEC 60352-5 standard covers several critical aspects of the connection process: 1. Requirements for Press-in Connections
The International Electrotechnical Commission (IEC) is a global organization that develops and publishes standards for electrical and electronic products. One of the key standards is IEC 60352-5, which deals with the safety requirements for solderless connections. In this blog post, we will provide an in-depth look at IEC 60352-5 PDF, its significance, and the key aspects of the standard.
: Deleted the bending test, which was deemed no longer common for modern press-in technology. Accessing the Full Document Test Methods IEC 60352‑5 is part of the
: It now covers "electrical and electronic equipment and components" generally, removing the narrow focus on telecommunications.
| Edition | Year | Key Features / Changes | | :--- | :--- | :--- | | First edition | 1995 | Initial publication. | | Second edition | 2001 | Incorporated Amendment 1. | | Third edition | 2008 | Minor technical revision. | | | 2012 | Introduced major changes: removed all tables with hole dimensions; added tolerance ranges for test‑board holes; included a requirement for test‑board thickness. | | Fifth edition | 2020 | Current version. Expanded the scope to all electrical and electronic equipment; added definitions for ‘board’, ‘hole’ and ‘metal board’; removed the bending test; added press‑in and push‑out force graphs; reduced the number of test specimens required. |